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4.1. Properties and Characterization of the Pure Tin Solder.

There are several characterization methods that used on the indented pure tin solder such as Energy Dispersive X-ray Spectroscopy (EDS) which analyze the elements of the pure Tin solder samples. The Scanning Electron Microscope (SEM) is used to view the formation of the pure tin whisker which formed under the controlled parameter of external stress and high temperature surrounding.

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4.2. The Surface Morphology

After the constant indentation of the steel ball, the surface morphology of the pure tin whiskers formed near the indentation of steel ball are viewed via SEM are classified into the nodules and hillocks formations. Besides that, the formation of the intermetallic compound of Cu6Sn5 through the annealing process at 150 oC for 240 hours also observed.

4.2.1. Effect of Stress on the Pure Tin Solder.

The parameters of stress which set up on the sample is manipulated by the different value of weight used, which are 200 g and 400 g. Both indentation of took placed at ambient condition with different duration of indentation period which are 24 hours and 240 hours. While, the third pure tin solder sample is indented at the elevated temperature of 150 oC for 240 hours